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%0 Conference Paper
%1 conf/3dic/CioccioGTSBVZVDLABCCC09
%A Cioccio, Léa Di
%A Gueguen, Pierric
%A Taibi, Rachid
%A Signamarcheix, Thomas
%A Bally, Laurent
%A Vandroux, Laurent
%A Zussy, Marc
%A Verrun, Sophie
%A Dechamp, Jérôme
%A Leduc, Patrick
%A Assous, Myriam
%A Bouchu, David
%A de Crecy, François
%A Chapelon, Laurent-Luc
%A Clavelier, Laurent
%B 3DIC
%D 2009
%I IEEE
%K dblp
%P 1-4
%T An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#CioccioGTSBVZVDLABCCC09
%@ 978-1-4244-4512-7
@inproceedings{conf/3dic/CioccioGTSBVZVDLABCCC09,
added-at = {2010-03-24T00:00:00.000+0100},
author = {Cioccio, Léa Di and Gueguen, Pierric and Taibi, Rachid and Signamarcheix, Thomas and Bally, Laurent and Vandroux, Laurent and Zussy, Marc and Verrun, Sophie and Dechamp, Jérôme and Leduc, Patrick and Assous, Myriam and Bouchu, David and de Crecy, François and Chapelon, Laurent-Luc and Clavelier, Laurent},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/25a39565222eebb7c7c8f30c691d0bd50/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2009},
ee = {http://dx.doi.org/10.1109/3DIC.2009.5306534},
interhash = {3c962cfff7816b5187e10a4a1885e737},
intrahash = {5a39565222eebb7c7c8f30c691d0bd50},
isbn = {978-1-4244-4512-7},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2016-02-02T14:29:06.000+0100},
title = {An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#CioccioGTSBVZVDLABCCC09},
year = 2009
}