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Impact of intermediate BEOL technology on standard cell performances of 3D VLSI., , , , , , , , , and 3 other author(s). ESSDERC, page 218-221. IEEE, (2016)3D FPGA using high-density interconnect Monolithic Integration., , , , and . DATE, page 1-4. European Design and Automation Association, (2014)From 2D to monolithic 3D predictive design platform: An innovative migration methodology for benchmark purpose., , , , , , , , and . 3DIC, page 1-5. IEEE, (2016)Delay partitioning helps reducing variability in 3DVLSI., , , , and . ESSCIRC, page 75-78. IEEE, (2016)A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool., , , , , , , , , and 6 other author(s). DATE, page 1192-1196. ACM, (2015)From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges., , , , , , , , , and 2 other author(s). ISPD, page 127. ACM, (2015)A high-level design rule library addressing CMOS and heterogeneous technologies., , , , , , and . ICICDT, page 1-4. IEEE, (2014)Towards ultra-dense arrays of VHF NEMS with FDSOI-CMOS active pixels for sensing applications., , , , , , , and . ISSCC, page 320-322. IEEE, (2012)Guidelines for intermediate back end of line (BEOL) for 3D sequential integration., , , , , , , , , and 18 other author(s). ESSDERC, page 252-255. IEEE, (2017)