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New process for selective additive metallization of alumina ceramic substrates

, , , , , , and . IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1): 138-145 (2019)

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New process for selective additive metallization of alumina ceramic substrates, , , , , , and . IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1): 138-145 (2019)Interaction Of Haptics, Acoustics And Optics in The Perception Of Rotatory Control Devices, , , and . Proceedings Of The AHFE 2016 International Conference On Ergonomics Modeling, Usability & Special Populations, page 599--611. (2016)New Process for Selective Additive Metallization of Alumina Ceramic Substrates, , , , , , and . IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1): 138-145 (2019)Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation, , , , and . Microelectronics Reliability, (2020)31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2020.Expanding the range of application of laser structured 3D-MID by using ceramic substrate materials,Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen Substratmaterialien, , , , , , , , and . MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings, (2021)Identifying Difference Thresholds Of Haptics And Acoustics Of Control Devices, , and . Advances in Human Aspects Of Transportation. Proceedings Of The AHFE 2017 International Conference On Human Factors in Transportation, page 337--348. (2017)Quantitative nanoscale MRI with a wide field of view, , , , , , , , , and 95 other author(s). (2019)Fabrication of 3D ceramic interconnect devices by laser induced selective metallization, , , , , , , and . Smart Systems Integration 2018 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, (2018)Laser Induced Selective Metallization of 3D Ceramic Interconnect Devices, , , , , , , and . 2018 13th International Congress Molded Interconnect Devices, MID 2018, (2018)SMART SYSTEMS INTEGRATION 2018-INTERNATIONAL CONFERENCE AND EXHIBITION ON INTEGRATION ISSUES OF MINIATURIZED SYSTEMS, , , , , , , , , and 1 other author(s). Development, (2018)