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New process for selective additive metallization of alumina ceramic substrates

E. Ermantraut, H. Muller, W. Eberhardt, P. Ninz, F. Kern, R. Gadow, and A. Zimmermann. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1): 138-145 (2019)

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E. Garrelts

E. Zafeiriou

P. E. Bl\"ochl

Andr{\'{e}} Buchau

Umm-E Habiba University of Stuttgart

Other publications of authors with the same name

New Process for Selective Additive Metallization of Alumina Ceramic SubstratesE. Ermantraut, H. Müller, W. Eberhardt, P. Ninz, F. Kern, R. Gadow, and A. Zimmermann. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1): 138-145 (2019)New process for selective additive metallization of alumina ceramic substratesE. Ermantraut, H. Muller, W. Eberhardt, P. Ninz, F. Kern, R. Gadow, and A. Zimmermann. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1): 138-145 (2019)Fabrication of 3D ceramic interconnect devices by laser induced selective metallizationE. Ermantraut, A. Zimmermann, H. Müller, M. Wolf, W. Eberhardt, P. Ninz, F. Kern, and R. Gadow. Smart Systems Integration 2018 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, (2018)Laser Induced Selective Metallization of 3D Ceramic Interconnect DevicesE. Ermantraut, A. Zimmermann, H. Muller, M. Wolf, W. Eberhardt, P. Ninz, F. Kern, and R. Gadow. 2018 13th International Congress Molded Interconnect Devices, MID 2018, (2018)Doping of Alumina Substrates for Laser Induced Selective MetallizationP. Ninz, F. Kern, E. Ermantraut, H. Müller, W. Eberhardt, A. Zimmermann, and R. Gadow. Procedia CIRP, (2018)SMART SYSTEMS INTEGRATION 2018-INTERNATIONAL CONFERENCE AND EXHIBITION ON INTEGRATION ISSUES OF MINIATURIZED SYSTEMSE. Ermantraut, A. Zimmermann, H. Müller, M. Wolf, W. Eberhardt, P. Ninz, F. Kern, R. Gadow, I. Popova, S. Konakov and 1 other author(s). Development, (2018)