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New process for selective additive metallization of alumina ceramic substrates

E. Ermantraut, H. Muller, W. Eberhardt, P. Ninz, F. Kern, R. Gadow, and A. Zimmermann. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1): 138-145 (2019)

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Dr. Philipp Ninz University of Stuttgart

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P. Hommel

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P. E. Bl\"ochl

Other publications of authors with the same name

Doping of Alumina Substrates for Laser Induced Selective MetallizationP. Ninz, F. Kern, E. Ermantraut, H. Müller, W. Eberhardt, A. Zimmermann, and R. Gadow. Procedia CIRP, (2018)New process for selective additive metallization of alumina ceramic substratesE. Ermantraut, H. Muller, W. Eberhardt, P. Ninz, F. Kern, R. Gadow, and A. Zimmermann. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1): 138-145 (2019)SMART SYSTEMS INTEGRATION 2018-INTERNATIONAL CONFERENCE AND EXHIBITION ON INTEGRATION ISSUES OF MINIATURIZED SYSTEMSE. Ermantraut, A. Zimmermann, H. Müller, M. Wolf, W. Eberhardt, P. Ninz, F. Kern, R. Gadow, I. Popova, S. Konakov and 1 other author(s). Development, (2018)Expanding the range of application of laser structured 3D-MID by using ceramic substrate materials,Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen SubstratmaterialienA. Schilling, P. Ninz, S. Petillon, S. Weser, A. Knöller, W. Eberhardt, T. Günther, F. Kern, and A. Zimmermann. MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings, (2021)Fabrication of 3D ceramic interconnect devices by laser induced selective metallizationE. Ermantraut, A. Zimmermann, H. Müller, M. Wolf, W. Eberhardt, P. Ninz, F. Kern, and R. Gadow. Smart Systems Integration 2018 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, (2018)Laser Induced Selective Metallization of 3D Ceramic Interconnect DevicesE. Ermantraut, A. Zimmermann, H. Muller, M. Wolf, W. Eberhardt, P. Ninz, F. Kern, and R. Gadow. 2018 13th International Congress Molded Interconnect Devices, MID 2018, (2018)