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New process for selective additive metallization of alumina ceramic substrates

E. Ermantraut, H. Muller, W. Eberhardt, P. Ninz, F. Kern, R. Gadow, and A. Zimmermann. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1): 138-145 (2019)

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Lisa Eberhardt University of Stuttgart

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New process for selective additive metallization of alumina ceramic substratesE. Ermantraut, H. Muller, W. Eberhardt, P. Ninz, F. Kern, R. Gadow, and A. Zimmermann. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1): 138-145 (2019)Low Cost Fabrication Technology for Microfluidic Devices Based on Micro Injection MouldingW. Eberhardt, H. Kück, P. Koltay, M. Münch, H. Sandmaier, M. Spitzendorfer, R. Steger, M. Willmann, and R. Zengerle. Proceedings - MICRO.tec 2003 : applications, trends, visions, Berlin, VDE-Verl., (2003)Doping of Alumina Substrates for Laser Induced Selective MetallizationP. Ninz, F. Kern, E. Ermantraut, H. Müller, W. Eberhardt, A. Zimmermann, and R. Gadow. Procedia CIRP, (2018)Fabrication of 3D ceramic interconnect devices by laser induced selective metallizationE. Ermantraut, A. Zimmermann, H. Müller, M. Wolf, W. Eberhardt, P. Ninz, F. Kern, and R. Gadow. Smart Systems Integration 2018 - International Conference and Exhibition on Integration Issues of Miniaturized Systems, (2018)Laser Induced Selective Metallization of 3D Ceramic Interconnect DevicesE. Ermantraut, A. Zimmermann, H. Muller, M. Wolf, W. Eberhardt, P. Ninz, F. Kern, and R. Gadow. 2018 13th International Congress Molded Interconnect Devices, MID 2018, (2018)New Process for Selective Additive Metallization of Alumina Ceramic SubstratesE. Ermantraut, H. Müller, W. Eberhardt, P. Ninz, F. Kern, R. Gadow, and A. Zimmermann. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1): 138-145 (2019)Expanding the range of application of laser structured 3D-MID by using ceramic substrate materials,Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen SubstratmaterialienA. Schilling, P. Ninz, S. Petillon, S. Weser, A. Knöller, W. Eberhardt, T. Günther, F. Kern, and A. Zimmermann. MikroSystemTechnik Kongress 2021: Mikroelektronik, Mikrosystemtechnik und ihre Anwendungen - Innovative Produkte fur zukunftsfahige Markte, Proceedings, (2021)SMART SYSTEMS INTEGRATION 2018-INTERNATIONAL CONFERENCE AND EXHIBITION ON INTEGRATION ISSUES OF MINIATURIZED SYSTEMSE. Ermantraut, A. Zimmermann, H. Müller, M. Wolf, W. Eberhardt, P. Ninz, F. Kern, R. Gadow, I. Popova, S. Konakov and 1 other author(s). Development, (2018)VECTA - Virtual endoscopic CT-AngiographyP. Hastreiter, T. Ertl, B. Tomandl, and K. Eberhardt. 4th International Workshop on Rapid Prototyping in Medicine and Computer-Assisted Surgery, (1997)Combining Local and Remote Visualization Techniques for Interactive Volume Rendering in Medical ApplicationsK. Engel, P. Hastreiter, B. Tomandl, K. Eberhardt, and T. Ertl. Proceedings of IEEE Visualization '00, (2000)