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Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation

, , , , and . Microelectronics Reliability, (2020)31st European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2020.
DOI: https://doi.org/10.1016/j.microrel.2020.113813

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