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Statistical aspects of the degradation of LDD nMOSFETs., , , , , , , , and . Microelectronics Reliability, 42 (9-11): 1409-1413 (2002)Role of Defects in the Reliability of HfO2/Si-Based Spacer Dielectric Stacks for Local Interconnects., , , , , and . IRPS, page 1-6. IEEE, (2019)High-resolution SILC measurements of thin SiO2 at ultra low voltages., , , , , , , , , and . Microelectronics Reliability, 42 (9-11): 1485-1489 (2002)Constant voltage electromigration for advanced BEOL copper interconnects., , , , , , , and . IRPS, page 2. IEEE, (2015)TEASE: a systematic analysis framework for early evaluation of FinFET-based advanced technology nodes., , , , , , , , , and 2 other author(s). DAC, page 24:1-24:6. ACM, (2013)As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability., , , , , , , , , and 1 other author(s). Microelectronics Reliability, 54 (9-10): 1675-1679 (2014)Efficient System Exploration and Synthesis of Applications with Dynamic Data Storage and Intensive Data Transfer., , , , , , , , , and . DAC, page 76-81. ACM Press, (1998)Cu pumping in TSVs: Effect of pre-CMP thermal budget., , , , , , , , , and . Microelectronics Reliability, 51 (9-11): 1856-1859 (2011)Insights into metal drift induced failure in MOL and BEOL., , , , , , and . IRPS, page 3. IEEE, (2018)Design Technology co-optimization for N10., , , , , , , , , and 18 other author(s). CICC, page 1-8. IEEE, (2014)