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Interconnect and Thermal-aware Floorplanning for 3D Microprocessors.

, , , , and . ISQED, page 98-104. IEEE Computer Society, (2006)

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Networks on Chip (NoC): Interconnects of Next Generation Systems on Chip., , , and . Advances in Computers, (2005)Interconnect and Thermal-aware Floorplanning for 3D Microprocessors., , , , and . ISQED, page 98-104. IEEE Computer Society, (2006)A generic reconfigurable neural network architecture as a network on chip., , , , and . SoCC, page 191-194. IEEE, (2004)Load Miss Prediction - Exploiting Power Performance Trade-offs., , , and . IPDPS, page 1-8. IEEE, (2007)A Holistic Approach to Designing Energy-Efficient Cluster Interconnects., , , , , , and . IEEE Trans. Computers, 54 (6): 660-671 (2005)Implementing LDPC Decoding on Network-on-Chip., , , and . VLSI Design, page 134-137. IEEE Computer Society, (2005)Energy optimization techniques in cluster interconnects., , , , , , , and . ISLPED, page 459-464. ACM, (2003)Design of Thermally Robust Clock Trees Using Dynamically Adaptive Clock Buffers., , , , , , and . IEEE Trans. on Circuits and Systems, 56-I (2): 374-383 (2009)Resource-Driven Optimizations for Transient-Fault Detecting SuperScalar Microarchitectures., , , , and . Asia-Pacific Computer Systems Architecture Conference, volume 3740 of Lecture Notes in Computer Science, page 200-214. Springer, (2005)Thermally robust clocking schemes for 3D integrated circuits., , , , , , and . DATE, page 1206-1211. EDA Consortium, San Jose, CA, USA, (2007)