%0 Conference Paper %1 conf/isqed/HungLXVI06 %A Hung, Wei-Lun %A Link, Greg M. %A Xie, Yuan %A Vijaykrishnan, Narayanan %A Irwin, Mary Jane %B ISQED %D 2006 %I IEEE Computer Society %K dblp %P 98-104 %T Interconnect and Thermal-aware Floorplanning for 3D Microprocessors. %U http://dblp.uni-trier.de/db/conf/isqed/isqed2006.html#HungLXVI06 %@ 0-7695-2523-7

@inproceedings{conf/isqed/HungLXVI06, added-at = {2014-09-27T00:00:00.000+0200}, author = {Hung, Wei-Lun and Link, Greg M. and Xie, Yuan and Vijaykrishnan, Narayanan and Irwin, Mary Jane}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2117548bcd7621e157ea2e79c94e5789c/dblp}, booktitle = {ISQED}, crossref = {conf/isqed/2006}, ee = {http://doi.ieeecomputersociety.org/10.1109/ISQED.2006.77}, interhash = {7fe32653fa1f5b1d67bab379e7f9aced}, intrahash = {117548bcd7621e157ea2e79c94e5789c}, isbn = {0-7695-2523-7}, keywords = {dblp}, pages = {98-104}, publisher = {IEEE Computer Society}, timestamp = {2016-02-02T13:52:54.000+0100}, title = {Interconnect and Thermal-aware Floorplanning for 3D Microprocessors.}, url = {http://dblp.uni-trier.de/db/conf/isqed/isqed2006.html#HungLXVI06}, year = 2006 }