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Fault detection and isolation of multiple defects in through silicon via (TSV) channel., , , , , , and . 3DIC, page 1-5. IEEE, (2014)Incremental training of CNNs for user customization: work-in-progress., , , , , , , , , and 1 other author(s). CASES, page 9:1-9:2. ACM, (2017)Improved B-spline image registration between exhale and inhale lung CT images based on intensity and gradient orientation information., , , , , and . Medical Imaging: Image Processing, volume 9784 of SPIE Proceedings, page 978440. SPIE, (2016)Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs., , , , , , and . 3DIC, page 1-6. IEEE, (2014)Non-contact wafer-level TSV connectivity test methodology using magnetic coupling., , , , , , , , and . 3DIC, page 1-4. IEEE, (2013)Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling., , , , , , , , and . EMC Compo, page 158-162. IEEE, (2013)Design space exploration and implementation of a high performance and low area Coarse Grained Reconfigurable Processor., , , , and . FPT, page 67-70. IEEE, (2012)Hardware and a Tool Chain for ADRES., , , , , , , , , and 6 other author(s). ARC, volume 3985 of Lecture Notes in Computer Science, page 425-430. Springer, (2006)An instruction-scheduling-aware data partitioning technique for coarse-grained reconfigurable architectures., , , , , , , and . LCTES, page 151-160. ACM, (2011)Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation., , , , , , and . 3DIC, page TS8.29.1-TS8.29.4. IEEE, (2015)