H. Bürkle, T. Klotz, R. Krapf, und J. Anders. ESSCIRC 2021 : IEEE 47th European Solid State Circuits Conference (ESSCIRC), Seite 327-330. Piscataway, IEEE, (2021)
A. Sakr, M. Hassan, und J. Anders. ESSCIRC 2021 : IEEE 47th European Solid State Circuits Conference (ESSCIRC), Seite 211-214. Piscataway, IEEE, (2021)
J. Gebert, R. Schneider, P. Helwig, und J. Schenkengel. Dataset, (2021)Related to: Schnabel, Benjamin; Gebert, Johannes; Schneider, Ralf; Helwig, Peter (2023) ‘Towards the Simulation of Bone-implant Systems with a Stratified Material Model’. Technology and Health Care, 31 (4), 1555-1566. doi: 10.3233/THC-237001.
V. Tietz, J. Schöpf, A. Waldvogel, und B. Annighöfer. 2021 ACM/IEEE 24th International Conference on Model Driven Engineering Languages and Systems (MODELS), Seite 163-169. Piscataway, IEEE, (2021)