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Disambiguation of "Lim, Sung-Kyu"

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Security Closure of Physical Layouts ICCAD Special Session Paper

, , , , , , , , and . 2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD), Piscataway, IEEE, (2021)
DOI: 10.1109/ICCAD51958.2021.9643543

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Jaekeun Lim University of Stuttgart

 

Other publications of authors with the same name

Die-to-Die Parasitic Extraction Targeting Face-to-Face Bonded 3D ICs., and . J. Inform. and Commun. Convergence Engineering, (2015)Stacking integration methodologies in 3D IC for 3D ultrasound image processing application: A stochastic flash ADC design case study., , and . ISCAS, page 1266-1269. IEEE, (2015)Chip/Package Mechanical Stress Impact on 3-D IC Reliability and Mobility Variations., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 32 (11): 1694-1707 (2013)TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC., , , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 31 (8): 1194-1207 (2012)Multi-TSV and E-Field Sharing Aware Full-chip Extraction and Mitigation of TSV-to-Wire Coupling., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 34 (12): 1964-1976 (2015)Block-level 3D IC design with through-silicon-via planning., , and . ASP-DAC, page 335-340. IEEE, (2012)How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core., , , , , , , , , and 3 other author(s). CICC, page 1-4. IEEE, (2013)Backend Dielectric Reliability Full Chip Simulator., , , , and . IEEE Trans. VLSI Syst., 22 (8): 1750-1762 (2014)Distributed TSV Topology for 3-D Power-Supply Networks., and . IEEE Trans. VLSI Syst., 20 (11): 2066-2079 (2012)Net-Sensitivity-Based Optimization of Large-Scale Field-Programmable Analog Array (FPAA) Placement and Routing., , and . IEEE Trans. on Circuits and Systems, 56-II (7): 565-569 (2009)