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Laser Induced Selective Metallization of 3D Ceramic Interconnect Devices

, , , , , , , and . 2018 13th International Congress Molded Interconnect Devices (MID), IEEE, (2018)
DOI: 10.1109/ICMID.2018.8526993

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Improving orchestral conducting systems in public spaces: examining the temporal characteristics and conceptual models of conducting gestures., , and . CHI, page 731-740. ACM, (2005)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , and 2 other author(s). 2018 13th International Congress Molded Interconnect Devices (MID), IEEE, (2018)Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High-Frequency and Mixed-Signal Systems with MID Technology, , , , , , , , , and . 12th Smart Systems Integration : International Conference and Exhibition on Integration Issues of Miniaturized Systems, page 488-491. Frankfurt am Main, Mesago Messe Frankfurt GmbH, (2018)Wie gut ist mein Unternehmen im Usability Engineering und wie kann es (noch) besser werden?, , , , , and . Usability Professionals, page 144-147. German UPA e.V., (2012)Education, entertainment and authenticity: lessons learned from designing an interactive exhibit about medieval music., , and . CHI Extended Abstracts, page 1887-1892. ACM, (2007)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Fabrication of 3D Ceramic Interconnect Devices by Laser Induced Selective Metalization, , , , , , , and . (2018)Investigation of LDS-capable PEEK/PEI Blends for Customizable Multilayer LDS-MID for Fabrication ofo Millimeter Wave-Capable High Frequency Module, , , , , , and . (June 2023)Impedance-controlled design and connection technology for micromounting and hybrid integration of high-frequency and mixed-signal systems with MID technology, , , , , , , , , and . Smart Systems Integration 2018 : International Conference and Exhibition on Integration Issues of Miniaturized Systems, page 488-491. Auerbach, Verlag Wissenschaftliche Scripten, (2018)Laser Induced Selective Metallization of 3D Ceramic Interconnect Devices, , , , , , , and . 2018 13th International Congress Molded Interconnect Devices (MID), IEEE, (2018)