%0 Conference Paper %1 ermantraut2018laser %A Ermantraut, Eugen %A Zimmermann, André %A Müller, Hagen %A Wolf, Marius %A Eberhardt, Wolfgang %A Ninz, Philipp %A Kern, Frank %A Gadow, Rainer %B 2018 13th International Congress Molded Interconnect Devices (MID) %D 2018 %I IEEE %K %R 10.1109/ICMID.2018.8526993 %T Laser Induced Selective Metallization of 3D Ceramic Interconnect Devices %@ 978-1-5386-4933-6 and 978-1-5386-4932-9 and 978-1-5386-4934-3

@inproceedings{ermantraut2018laser, added-at = {2024-06-07T16:21:34.000+0200}, author = {Ermantraut, Eugen and Zimmermann, André and Müller, Hagen and Wolf, Marius and Eberhardt, Wolfgang and Ninz, Philipp and Kern, Frank and Gadow, Rainer}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/22f86483dd7f044d5da1473a1d87ae584/unibiblio}, booktitle = {2018 13th International Congress Molded Interconnect Devices (MID)}, doi = {10.1109/ICMID.2018.8526993}, eventdate = {2018-09-25/2018-09-26}, eventtitle = {2018 13th International Congress Molded Interconnect Devices (MID)}, interhash = {f19695af12c3db48450700d4479c7d84}, intrahash = {2f86483dd7f044d5da1473a1d87ae584}, isbn = {{978-1-5386-4933-6} and {978-1-5386-4932-9} and {978-1-5386-4934-3}}, keywords = {}, language = {eng}, publisher = {IEEE}, timestamp = {2024-06-07T14:21:34.000+0200}, title = {Laser Induced Selective Metallization of 3D Ceramic Interconnect Devices}, venue = {Würzburg}, year = 2018 }