Autor der Publikation

Kopieren Löschen Diese Publikation zur Ablage hinzufügen
Community-Eintrag
Versionsverlauf dieses Eintrags
URL
DOI
BibTeX
EndNote
APA
Chicago
DIN 1505
Harvard
MSOffice XML

Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High-Frequency and Mixed-Signal Systems with MID Technology

V. Geneiß, T. Lüke, C. Hedayat, M. Wolf, F. Janek, T. Meissner, M. Barth, W. Eberhardt, A. Zimmermann, und T. Otto. 12th Smart Systems Integration : International Conference and Exhibition on Integration Issues of Miniaturized Systems, Seite 488-491. Frankfurt am Main, Mesago Messe Frankfurt GmbH, (2018)

Bitte wählen Sie eine Person um die Publikation zuzuordnen

Um zwischen Personen mit demselben Namen zu unterscheiden, wird der akademische Grad und der Titel einer wichtigen Publikation angezeigt. Zudem lassen sich über den Button neben dem Namen einige der Person bereits zugeordnete Publikationen anzeigen.

Dr. rer. nat. Simon Barth University of Stuttgart

Rahul Barthwal University of Stuttgart

Lukas Bartholomäus University of Stuttgart

Prof. Dr. Holger Barth University of Stuttgart

Univ. -Prof. Dr. Andrea Barth University of Stuttgart

Weitere Publikationen von Autoren mit dem selben Namen

Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS TechnologyM. Wolf, F. Janek, T. Meißner, B. Wigger, M. Barth, T. Günther, W. Eberhardt, V. Geneiß, T. Lueke, C. Hedayat und 1 andere Autor(en). (September 2018)Heat dissipation for MID applications in lighting technologyM. Barth, R. Kulkarni, W. Eberhardt, T. Meißner, M. Soltani, und A. Zimmermann. 2016 12th International Congress Molded Interconnect Devices (MID), IEEE, (2016)Impedance-controlled design and connection technology for micromounting and hybrid integration of high-frequency and mixed-signal systems with MID technologyV. Geneiß, T. Lüke, C. Hedayat, M. Wolf, F. Janek, T. Meißner, M. Barth, W. Eberhardt, A. Zimmermann, und T. Otto. Smart Systems Integration 2018 : International Conference and Exhibition on Integration Issues of Miniaturized Systems, Seite 488-491. Auerbach, Verlag Wissenschaftliche Scripten, (2018)Robust and fast part traceability in a production chain exploiting inherent, individual surface patternsB. Wigger, I. Koinzer, T. Meißner, M. Barth, und A. Zimmermann. Robotics and Computer-Integrated Manufacturing, (2020)Aerosol Jet Printing and Interconnection Technologies on Additive Manufactured SubstratesK. Werum, E. Müller, J. Keck, J. Jäger, T. Horter, K. Gläser, S. Buschkamp, M. Barth, W. Eberhardt, und A. Zimmermann. Journal of manufacturing and materials processing, 6 (5): 119 (2022)Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime CharacterizationR. Saleh, S. Schütt, M. Barth, T. Lang, W. Eberhardt, und A. Zimmermann. Micromachines, 13 (8): 1240 (2022)Digital Process Chain for Processing of Bend-Sensitive Functional Structures on a Flexible SubstrateR. Saleh, F. Mohn, M. Barth, W. Eberhardt, und A. Zimmermann. IEEE transactions on components and packaging technologies, 11 (9): 1417-1425 (2021)Development of a Micro-integrated hyperspectral imaging systemT. Günther, F. Hausladen, M. Barth, M. Roeder, F. Janek, D. Drossart, H. Wurm, S. Sahakalkan, K. Stock, und A. Zimmermann. MikroSystemTechnik Congress 2021, Seite 598-601. Berlin, VDE Verlag, (2021)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental TestingM. Wolf, F. Janek, T. Meißner, B. Wigger, M. Barth, T. Günther, W. Eberhardt, A. Zimmermann, V. Geneiß, T. Lueke und 2 andere Autor(en). 2018 13th International Congress Molded Interconnect Devices (MID), IEEE, (2018)Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High-Frequency and Mixed-Signal Systems with MID TechnologyV. Geneiß, T. Lüke, C. Hedayat, M. Wolf, F. Janek, T. Meissner, M. Barth, W. Eberhardt, A. Zimmermann, und T. Otto. 12th Smart Systems Integration : International Conference and Exhibition on Integration Issues of Miniaturized Systems, Seite 488-491. Frankfurt am Main, Mesago Messe Frankfurt GmbH, (2018)