Autor der Publikation

Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing

, , , , , , , , , , , und . 2018 13th International Congress Molded Interconnect Devices (MID), IEEE, (2018)
DOI: 10.1109/ICMID.2018.8527007

Bitte wählen Sie eine Person um die Publikation zuzuordnen

Um zwischen Personen mit demselben Namen zu unterscheiden, wird der akademische Grad und der Titel einer wichtigen Publikation angezeigt. Zudem lassen sich über den Button neben dem Namen einige der Person bereits zugeordnete Publikationen anzeigen.

 

Weitere Publikationen von Autoren mit dem selben Namen

Improving orchestral conducting systems in public spaces: examining the temporal characteristics and conceptual models of conducting gestures., , und . CHI, Seite 731-740. ACM, (2005)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , und 2 andere Autor(en). 2018 13th International Congress Molded Interconnect Devices (MID), IEEE, (2018)Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High-Frequency and Mixed-Signal Systems with MID Technology, , , , , , , , , und . 12th Smart Systems Integration : International Conference and Exhibition on Integration Issues of Miniaturized Systems, Seite 488-491. Frankfurt am Main, Mesago Messe Frankfurt GmbH, (2018)iSymphony: an adaptive interactive orchestral conducting system for digital audio and video streams., , , , , , und . CHI Extended Abstracts, Seite 259-262. ACM, (2006)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , und 2 andere Autor(en). 13th International Congress Molded Interconnect Devices, Seite 329. Molded Interconnect Devices 3-D MID e. V., (September 2018)Low-Loss 3D-Coplanar Line Structure for Millimeter Wave Applications Using Laser Direct Structuring Technology, , , , , und . 2021 International Conference on Electromagnetics in Advanced Applications (ICEAA), Seite 085. IEEE, (2021)Wie gut ist mein Unternehmen im Usability Engineering und wie kann es (noch) besser werden?, , , , , und . Usability Professionals, Seite 144-147. German UPA e.V., (2012)Education, entertainment and authenticity: lessons learned from designing an interactive exhibit about medieval music., , und . CHI Extended Abstracts, Seite 1887-1892. ACM, (2007)Investigation of LDS-capable PEEK/PEI Blends for Customizable Multilayer LDS-MID for Fabrication ofo Millimeter Wave-Capable High Frequency Module, , , , , , und . (Juni 2023)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , und 1 andere Autor(en). (September 2018)