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Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing

, , , , , , , , , , , and . 2018 13th International Congress Molded Interconnect Devices (MID), IEEE, (2018)
DOI: 10.1109/ICMID.2018.8527007

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Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , and 2 other author(s). 13th International Congress Molded Interconnect Devices, page 329. Molded Interconnect Devices 3-D MID e. V., (September 2018)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Impedance-controlled design and connection technology for micromounting and hybrid integration of high-frequency and mixed-signal systems with MID technology, , , , , , , , , and . Smart Systems Integration 2018 : International Conference and Exhibition on Integration Issues of Miniaturized Systems, page 488-491. Auerbach, Verlag Wissenschaftliche Scripten, (2018)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , and 2 other author(s). (2018)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , and 2 other author(s). 2018 13th International Congress Molded Interconnect Devices (MID), IEEE, (2018)Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High-Frequency and Mixed-Signal Systems with MID Technology, , , , , , , , , and . 12th Smart Systems Integration : International Conference and Exhibition on Integration Issues of Miniaturized Systems, page 488-491. Frankfurt am Main, Mesago Messe Frankfurt GmbH, (2018)Optimized Micro-Mounting and Hybrid Integration of RF Mixed- Signal Systems based on MID Technology, , , , , , and . Smart Systems Integration : 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, Berlin, VDE Verlag, (2019)Embedded UHF RFID tag design process for rubber transmission belt using 3D model., , , , and . RFID-TA, page 97-102. IEEE, (2014)