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Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing

M. Wolf, F. Janek, T. Meißner, B. Wigger, M. Barth, T. Günther, W. Eberhardt, V. Geneiß, T. Lübke, C. Hedayat, T. Otto, and A. Zimmermann. (2018)

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Benedikt Kolb University of Stuttgart

Benedikt Maurer University of Stuttgart

Benedikt Wiedemann University of Stuttgart

Benedikt Breitenhuber University of Stuttgart

Benedikt Posner

Other publications of authors with the same name

Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS TechnologyM. Wolf, F. Janek, T. Meißner, B. Wigger, M. Barth, T. Guenther, W. Eberhardt, V. Geneiß, T. Lueke, C. Hedayat and 1 other author(s). (September 2018)Robust and fast part traceability in a production chain exploiting inherent, individual surface patternsB. Wigger, I. Koinzer, T. Meissner, M. Barth, and A. Zimmermann. Robotics and Computer-Integrated Manufacturing, (2020)3D-MID Evaluation and Validation for Space ApplicationsE. Hirt, K. Ruzicka, B. Wigger, M. Barth, R. Saleh, F. Janek, and E. Müller. IEEE 69th Electronic Components and Technology Conference, page 868-877. Piscataway, NJ, IEEE, (2019)Inhärente Oberflächenstrukturen als Identifikationsmerkmal zur markierungsfreien EinzelteilverfolgungB. Wigger. Universität Stuttgart, Stuttgart, Dissertation, (2020)Robust and fast part traceability in a production chain exploiting inherent, individual surface patternsB. Wigger, I. Koinzer, T. Meißner, M. Barth, and A. Zimmermann. Robotics and Computer-Integrated Manufacturing, (2020)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental TestingM. Wolf, F. Janek, T. Meißner, B. Wigger, M. Barth, T. Guenther, W. Eberhardt, A. Zimmermann, V. Geneiß, T. Lueke and 2 other author(s). 13th International Congress Molded Interconnect Devices, page 329. Molded Interconnect Devices 3-D MID e. V., (September 2018)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS TechnologyM. Wolf, F. Janek, T. Meißner, B. Wigger, M. Barth, T. Günther, W. Eberhardt, V. Geneiß, T. Lueke, C. Hedayat and 1 other author(s). (September 2018)Conceptual Planning of Micro-Assembly for a Better Utilization of Reconfigurable Manufacturing SystemsC. Gielisch, K. Fritz, B. Wigger, and A. Zimmermann. Applied Sciences, 10 (8): 2806 (2020)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental TestingM. Wolf, F. Janek, T. Meißner, B. Wigger, M. Barth, T. Günther, W. Eberhardt, V. Geneiß, T. Lübke, C. Hedayat and 2 other author(s). (2018)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS TechnologyM. Wolf, F. Janek, T. Meißner, B. Wigger, M. Barth, T. Guenther, W. Eberhardt, V. Geneiß, T. Luebke, C. Hedayat and 1 other author(s). (September 2018)

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Disambiguation of "Wigger, Benedikt"