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Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology

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Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Heat dissipation for MID applications in lighting technology, , , , , and . 2016 12th International Congress Molded Interconnect Devices (MID), IEEE, (2016)Impedance-controlled design and connection technology for micromounting and hybrid integration of high-frequency and mixed-signal systems with MID technology, , , , , , , , , and . Smart Systems Integration 2018 : International Conference and Exhibition on Integration Issues of Miniaturized Systems, page 488-491. Auerbach, Verlag Wissenschaftliche Scripten, (2018)Assembly of Surface-Mounted Devices on Flexible Substrates by Isotropic Conductive Adhesive and Solder and Lifetime Characterization, , , , , and . Micromachines, 13 (8): 1240 (2022)Robust and fast part traceability in a production chain exploiting inherent, individual surface patterns, , , , and . Robotics and Computer-Integrated Manufacturing, (2020)Aerosol Jet Printing and Interconnection Technologies on Additive Manufactured Substrates, , , , , , , , , and . Journal of manufacturing and materials processing, 6 (5): 119 (2022)Development of a Micro-integrated hyperspectral imaging system, , , , , , , , , and . MikroSystemTechnik Congress 2021, page 598-601. Berlin, VDE Verlag, (2021)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , and 2 other author(s). 2018 13th International Congress Molded Interconnect Devices (MID), IEEE, (2018)Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High-Frequency and Mixed-Signal Systems with MID Technology, , , , , , , , , and . 12th Smart Systems Integration : International Conference and Exhibition on Integration Issues of Miniaturized Systems, page 488-491. Frankfurt am Main, Mesago Messe Frankfurt GmbH, (2018)Digital Process Chain for Processing of Bend-Sensitive Functional Structures on a Flexible Substrate, , , , and . IEEE transactions on components and packaging technologies, 11 (9): 1417-1425 (2021)