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Heat dissipation for MID applications in lighting technology

M. Barth, R. Kulkarni, W. Eberhardt, T. Meißner, M. Soltani, and A. Zimmermann. 2016 12th International Congress Molded Interconnect Devices (MID), page 112-115. (September 2016)

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Univ. -Prof. Dr. -Ing. André Zimmermann University of Stuttgart

75 Jahre Institut für Mikrointegration (IFM) Universität StuttgartA. Zimmermann, and I. Burk. Stuttgart, Universität Stuttgart, Institut für Mikrointegration, (2019)

André Jaquemod University of Stuttgart

Univ. -Prof. Dr. rer. nat. André Thess University of Stuttgart

Dr. -Ing. André Buchau University of Stuttgart

André Weiß University of Stuttgart

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