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Improving orchestral conducting systems in public spaces: examining the temporal characteristics and conceptual models of conducting gestures., , and . CHI, page 731-740. ACM, (2005)Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High-Frequency and Mixed-Signal Systems with MID Technology, , , , , , , , , and . (April 2018)iSymphony: an adaptive interactive orchestral conducting system for digital audio and video streams., , , , , , and . CHI Extended Abstracts, page 259-262. ACM, (2006)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , and 2 other author(s). 13th International Congress Molded Interconnect Devices, page 329. Molded Interconnect Devices 3-D MID e. V., (September 2018)Low-Loss 3D-Coplanar Line Structure for Millimeter Wave Applications Using Laser Direct Structuring Technology, , , , , and . 2021 International Conference on Electromagnetics in Advanced Applications (ICEAA), page 085-085. IEEE, (2021)Laser Induced Selective Metallization of 3D Ceramic Interconnect Devices, , , , , , , and . 13th International Congress Molded Interconnect Devices, page 328. Molded Interconnect Devices 3-D MID e. V., (September 2018)Analysis of Tempering Effects on LDS-MID and PCB Substrates for HF Applications, , , , , and . Journal of Manufacturing and Materials Processing, (2023)Injection compression molding for manufacturing LDS-MID based millimeter wave modules, , , , , , and . Proceedings of the 14th International Congress Molded Interconnect Devices, page 51-75. Molded Interconnect Devices 3-D MID e. V., (February 2021)Optimized Micro-Mounting and Hybrid Integration of RF Mixed- Signal Systems based on MID Technology, , , , , , and . Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systems, page 1-4. (2019)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , and 2 other author(s). (2018)