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Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology

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Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , and 2 other author(s). (2018)Injection Compression Molded Microlens Arrays for Hyperspectral Imaging, , , , , and . Micromachines, 9 (7): 355 (July 2018)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Rapid Prototyping von Molded Interconnect Devices (MID), , , , , , and . (2018)Feasibility Study of an Automated Assembly Process for Ultrathin Chips, , , , , , , and . Micromachines, 11 (7): 654 (2020)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Bestückung additiv gefertigter Mechatronic Interconnect Devices (MID) mittels Laserlöten, , , , , , and . MikroSystemTechnik Kongress 2017, page 360-362. VDE Verlag GmbH, (October 2017)Heat dissipation for MID applications in lighting technology, , , , , and . 2016 12th International Congress Molded Interconnect Devices (MID), page 112-115. (September 2016)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , and 2 other author(s). 13th International Congress Molded Interconnect Devices, page 329. Molded Interconnect Devices 3-D MID e. V., (September 2018)Robust and fast part traceability in a production chain exploiting inherent, individual surface patterns, , , , and . Robotics and Computer-Integrated Manufacturing, (2020)