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Disambiguation of "Janek, Florian"

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Entwicklung einer Prozesskette für den Aufbau individualisierter Foliensysteme

. Universität Stuttgart, Stuttgart, Dissertation, (2022)
DOI: 10.18419/opus-12617

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Florian Weiss

PD Dr. -Ing. Florian Bauer University of Stuttgart

Florian Helber University of Stuttgart

Florian Seibold University of Stuttgart

Florian Reichelt University of Stuttgart

 

Other publications of authors with the same name

Assembly and encapsulation of LED modules on a mechanical flexible textile wound dressing for blue light therapy, , , and . Proceedings of the 14th International Congress Molded Interconnect Devices, page 595-612. Molded Interconnect Devices 3-D MID e. V., (February 2021)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Development of a Micro-integrated hyperspectral imaging system, , , , , , , , , and . MikroSystemTechnik Congress 2021, page 1-4. (2021)3D-MID Evaluation and Validation for Space Applications, , , , , , and . IEEE 69th Electronic Components and Technology Conference, page 868-877. Piscataway, NJ, IEEE, (2019)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist, , , , , and . Micromachines, 12 (8): 856 (2021)Entwicklung einer Prozesskette für den Aufbau individualisierter Foliensysteme. Universität Stuttgart, Stuttgart, Dissertation, (2022)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Feasibility Study of an Automated Assembly Process for Ultrathin Chips, , , , , , , and . Micromachines, 11 (7): 654 (2020)Assembly of Multiple Ultrathin Chips on Flexible Foils With High Placement Accuracy by a Simple Transfer Process, , , , and . IEEE Transactions on Components Packaging and Manufacturing Technology, 9 (11): 2314-2319 (2019)