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Assembly of Multiple Ultrathin Chips on Flexible Foils With High Placement Accuracy by a Simple Transfer Process

F. Janek, S. Weser, M. Barth, W. Eberhardt, and A. Zimmermann. IEEE Transactions on Components Packaging and Manufacturing Technology, 9 (11): 2314-2319 (2019)
DOI: 10.1109/TCPMT.2019.2938189

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Sascha Kolatschek University of Stuttgart

Sascha Polatkan University of Stuttgart

Sascha Ritschel University of Stuttgart

Marvin Sascha Wahl University of Stuttgart

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Fine Pitch Metal Deposition on LDS MaterialsH. Mueller, S. Weser, W. Eberhardt, and H. Kueck. 4M/ICOMM 2015: proceedings of the 4M/ICOMM2015 Conference, page 482-485. Research Publishing, (2015)4M / ICOMM2015 Conference.Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen SubstratmaterialienA. Schilling, P. Ninz, S. Petillon, S. Weser, A. Knöller, W. Eberhardt, T. Guenther, F. Kern, and A. Zimmermann. MikroSystemTechnik Congress 2021, (2021)Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask ResistF. Janek, N. Eichhorn, S. Weser, K. Gläser, W. Eberhardt, and A. Zimmermann. Micromachines, 12 (8): 856 (2021)Umspritzen von Si-Nacktchips mit Thermoplast und deren Kontaktierung mit der LPKF-LDS® TechnikV. Mayer, W. Eberhardt, A. Fischer, M. Schober, S. Weser, H. Willeck, and H. Kueck. Beiträge zum 22. Stuttgarter Kunststoff-Kolloquium, (2011)Fabrication of Modules for an Interactive Braille Display with Integrated Touch Sensor by Laser MID TechnologyA. Fischer, D. Ahrendt, W. Eberhardt, U. Keßler, M. Schubert, S. Weser, H. Willeck, and H. Kueck. Proceedings of the 6th International Conference on Multi-Material Micro Manufacture, (September 2009)Rapid-Prototyping von MID mittels generativer VerfahrenH. Müller, S. Weser, Y. Liu, T. Günther, W. Eberhardt, and A. Zimmermann. (2015)Injection Molding of Encapsulated Diffractive Optical ElementsS. Wagner, K. Treptow, S. Weser, M. Drexler, S. Sahakalkan, W. Eberhardt, T. Guenther, C. Pruss, A. Herkommer, and A. Zimmermann. Micromachines, (2023)Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packagingF. Häußler, S. Shen, S. Petillon, S. Weser, M. Haybat, W. Eberhardt, A. Zimmermann, and J. Franke. International Symposium on Microelectronics, 2020 (1): 000140-000145 (January 2021)Laserstrukturierungen von robusten 3D-SchaltungsträgernE. Ermantraut, H. Mueller, W. Eberhardt, S. Weser, and H. Kueck. (October 2013)New Laser based Patterning Processes for 3D DevicesH. Mueller, S. Weser, E. Ermantraut, W. Eberhardt, and H. Kueck. Proceedings of the 10 International Conference on Multi-Material Micro Manufacture, page 156-159. (2013)