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Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Development of a Micro-integrated hyperspectral imaging system, , , , , , , , , and . MikroSystemTechnik Congress 2021, page 1-4. (2021)Assembly and encapsulation of LED modules on a mechanical flexible textile wound dressing for blue light therapy, , , and . Proceedings of the 14th International Congress Molded Interconnect Devices, page 595-612. Molded Interconnect Devices 3-D MID e. V., (February 2021)3D-MID Evaluation and Validation for Space Applications, , , , , , and . IEEE 69th Electronic Components and Technology Conference, page 868-877. Piscataway, NJ, IEEE, (2019)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist, , , , , and . Micromachines, 12 (8): 856 (2021)Entwicklung einer Prozesskette für den Aufbau individualisierter Foliensysteme. Universität Stuttgart, Stuttgart, Dissertation, (2022)Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High-Frequency and Mixed-Signal Systems with MID Technology, , , , , , , , , and . (April 2018)Verbesserung der Recyclingfähigkeit gedruckter Elektronik durch wasserlösliche Separationsschichten, , , , , , , and . VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik, (October 2023)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)