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Entwicklung einer Prozesskette für den Aufbau individualisierter Foliensysteme

. Universität Stuttgart, Stuttgart, Dissertation, (2022)
DOI: 10.18419/opus-12617

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Florian Reichelt University of Stuttgart

Future Automotive-UX – Integrating Foresight in Early Phase Concept Development, , , , and . Proceedings of The XXXIII ISPIM Innovation Conference "Innovating in a Digital World", page 1-16. The XXXIII ISPIM Innovation Conference "Innovating in a Digital World",, The XXXIII ISPIM Innovation Conference "Innovating in a Digital World",, (2022)

Florian Strohm University of Stuttgart

Neural Photofit : Gaze-based Mental Image Reconstruction, , , , , and . 2021 IEEE/CVF International Conference on Computer Vision (ICCV), page 245-254. Piscataway, IEEE, (2021)
 

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3D-MID Evaluation and Validation for Space Applications, , , , , , and . IEEE 69th Electronic Components and Technology Conference, page 868-877. Piscataway, NJ, IEEE, (2019)Development of a Micro-integrated hyperspectral imaging system, , , , , , , , , and . MikroSystemTechnik Congress 2021, page 1-4. (2021)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist, , , , , and . Micromachines, 12 (8): 856 (2021)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , and 2 other author(s). (2018)Feasibility Study of an Automated Assembly Process for Ultrathin Chips, , , , , , , and . Micromachines, 11 (7): 654 (2020)Assembly of Multiple Ultrathin Chips on Flexible Foils With High Placement Accuracy by a Simple Transfer Process, , , , and . IEEE Transactions on Components Packaging and Manufacturing Technology, 9 (11): 2314-2319 (2019)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)