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Multifunctional Packages by Assembly of SMD and Bare Dies on Molded Interconnect Devices (MID)

U. Keßler, C. Pein, W. Eberhardt, and H. Kueck. First International Conference on Multi-Material Micro Manufacture Proceedings, page 315-318. Elsevier, (2005)

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Lisa Eberhardt University of Stuttgart

Univ. -Prof. Dr. -Ing. Wolfgang Rheinheimer University of Stuttgart

Univ. -Prof. Dr. Wolfgang Kühnel University of Stuttgart

apl. Prof. Dr. Wolfgang Hauber University of Stuttgart

apl. Prof. Dr. Wolfgang Bolse University of Stuttgart

Other publications of authors with the same name

Bestückung additiv gefertigter Mechatronic Interconnect Devices (MID) mittels LaserlötenT. Meißner, E. Saller, T. Groezinger, T. Vieten, H. Mueller, W. Eberhardt, and A. Zimmermann. MikroSystemTechnik Kongress 2017, page 360-362. VDE Verlag GmbH, (October 2017)Heat dissipation for MID applications in lighting technologyM. Barth, R. Kulkarni, W. Eberhardt, T. Meißner, M. Soltani, and A. Zimmermann. 2016 12th International Congress Molded Interconnect Devices (MID), page 112-115. (September 2016)Inkjet and Aerosol Jet Printed Sensors on 2D and 3D SubstratesJ. Keck, B. Polzinger, V. Matic, W. Eberhardt, and H. Kueck. Proceedings AMA Conferences 2015 with SENSOR 2015 17th International Conference on Sensors and Measurement Technology and IRS2015 14th International Conference on Infrared Sensors & Systems, 566-569, AMA Service GmbH, (May 2015)Fabrication of 3D Ceramic Interconnect Devices by Laser Induced Selective MetalizationE. Ermantraut, A. Zimmermann, H. Mueller, M. Wolf, W. Eberhardt, P. Ninz, F. Kern, and R. Gadow. (2018)Investigation of LDS-capable PEEK/PEI Blends for Customizable Multilayer LDS-MID for Fabrication ofo Millimeter Wave-Capable High Frequency ModuleM. Wolf, W. Eberhardt, T. Guenther, A. Zimmermann, T. Scherzer, J. Utz, and H. Ruckdaeschel. (June 2023)Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask ResistF. Janek, N. Eichhorn, S. Weser, K. Gläser, W. Eberhardt, and A. Zimmermann. Micromachines, 12 (8): 856 (2021)Assembly of Components on Inkjet-Printed Silver Structures by SolderingD. Juric, S. Hämmerle, K. Gläser, W. Eberhardt, and A. Zimmermann. IEEE Transactions on Components Packaging and Manufacturing Technology, 9 (1): 156-162 (2019)UV-sintering of inkjet-printed conductive silver tracksB. Polzinger, F. Schoen, V. Matic, J. Keck, H. Willeck, W. Eberhardt, and H. Kueck. 2011 11th IEEE International Conference on Nanotechnology, page 201-204. (August 2011)Fabrication of Modules for an Interactive Braille Display with Integrated Touch Sensor by Laser MID TechnologyA. Fischer, D. Ahrendt, W. Eberhardt, U. Keßler, M. Schubert, S. Weser, H. Willeck, and H. Kueck. Proceedings of the 6th International Conference on Multi-Material Micro Manufacture, (September 2009)Umspritzen von Si-Nacktchips mit Thermoplast und deren Kontaktierung mit der LPKF-LDS® TechnikV. Mayer, W. Eberhardt, A. Fischer, M. Schober, S. Weser, H. Willeck, and H. Kueck. Beiträge zum 22. Stuttgarter Kunststoff-Kolloquium, (2011)