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Multifunctional Packages by Assembly of SMD and Bare Dies on Molded Interconnect Devices (MID)

U. Keßler, C. Pein, W. Eberhardt, and H. Kueck. First International Conference on Multi-Material Micro Manufacture Proceedings, page 315-318. Elsevier, (2005)

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Christopher Keßler University of Stuttgart

Dr. Manuel Keßler University of Stuttgart

Univ. -Prof. Dr. Ulrich Palm University of Stuttgart

Prof. Dr. Ulrich Weiß University of Stuttgart

Daniel Ulrich

Other publications of authors with the same name

Multifunctional Packages by Assembly of SMD and Bare Dies on Molded Interconnect Devices (MID)U. Keßler, C. Pein, W. Eberhardt, and H. Kueck. First International Conference on Multi-Material Micro Manufacture Proceedings, page 315-318. Elsevier, (2005)3D-Mikromontage: Anwendungsbeispiel mehrachsige MagnetfeldsensorenU. Keßler, J. Pütz, W. Eberhardt, H. Kück, and A. Zimmermann. PLUS, (October 2016)Aufbau konfigurierbarer Kamera-Mikrosysteme durch Kombination mikrotechnischer VerfahrenM. Barth, S. Beyer, H. Graf, H. Scheithauer, K. Ulrich, W. Eberhardt, and H. Kück. Von Bauelementen zu Systemen : proceedings : Mikrosystemtechnik-Kongress 2013, 14. - 16. Oktober 2013 in Aachen, page 127-130. Berlin, VDE-Verlag, (2013)Fabrication of Modules for an Interactive Braille Display with Integrated Touch Sensor by Laser MID TechnologyA. Fischer, D. Ahrendt, W. Eberhardt, U. Keßler, M. Schubert, S. Weser, H. Willeck, and H. Kueck. Proceedings of the 6th International Conference on Multi-Material Micro Manufacture, (September 2009)Untersuchungen zur Flip Chip Montage auf spritzgegossenen SchaltungsträgernU. Keßler. Universität Stuttgart, München, Dissertation, (2012)Module für ein interaktives Braille-Display mit integrierten Touch-Sensoren in LPKF-LDS®-TechnikA. Fischer, H. Kueck, W. Eberhardt, U. Keßler, M. Schubert, and H. Willeck. (May 2011)Interactive Braille Display with Integrated Touch Sensor by Laser MID TechnologyM. Schubert, D. Ahrendt, U. Keßler, H. Willek, W. Eberhardt, A. Fischer, H. Richter, K. Warkentin, U. Grotz, U. Baumann and 1 other author(s). (September 2008)Optimized contact elements for soldering MID (moulded interconnect devices) on PCBF. Burger, U. KEßler, M. Schober, W. Eberhardt, T. Groezinger, and H. Kueck. Smart systems integration 2011 / 5th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components, Dresden, Germany, 22 - 23 March 2011, (March 2011)Precision Micro Assembly of Optical Components on MID and PCB.J. Seybold, U. Kessler, K. Fritz, and H. Kück. IPAS, volume 435 of IFIP Advances in Information and Communication Technology, page 30-36. Springer, (2014)