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Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing., , , , , , , and . ISSCC, page 470-471. IEEE, (2009)An Inductive-Coupling DC Voltage Transceiver for Highly Parallel Wafer-Level Testing., , , , , , , and . J. Solid-State Circuits, 45 (10): 2057-2065 (2010)MuCCRA-Cube: A 3D dynamically reconfigurable processor with inductive-coupling link., , , , , , , , , and 2 other author(s). FPL, page 6-11. IEEE, (2009)A 2 Gb/s Bi-Directional Inter-Chip Data Transceiver With Differential Inductors for High Density Inductive Channel Array., , and . J. Solid-State Circuits, 43 (11): 2363-2369 (2008)Analysis of Inductive Coupling and Design of Rectifier Circuit for Inter-Chip Wireless Power Link., , and . IEICE Transactions, 93-C (2): 164-171 (2010)6W/25mm2 inductive power transfer for non-contact wafer-level testing., , , , , , and . ISSCC, page 230-232. IEEE, (2011)47% Power Reduction and 91% Area Reduction in Inductive-Coupling Programmable Bus for NAND Flash Memory Stacking., , , , and . IEEE Trans. on Circuits and Systems, 57-I (9): 2269-2278 (2010)A 6Gb/s receiver with discrete-time based channel filtering for wireline FDM communications., , , , , , and . CICC, page 1-4. IEEE, (2010)2 Gb/s 15 pJ/b/chip Inductive-Coupling Programmable Bus for NAND Flash Memory Stacking., , , , , , , and . J. Solid-State Circuits, 45 (1): 134-141 (2010)6 W/25 mm2 Wireless Power Transmission for Non-contact Wafer-Level Testing., , , , , , and . IEICE Transactions, 95-C (4): 668-676 (2012)