%0 Conference Paper %1 conf/isscc/RadeckiCYMSIK11 %A Radecki, Andrzej %A Chung, Hayun %A Yoshida, Yoichi %A Miura, Noriyuki %A Shidei, Tsunaaki %A Ishikuro, Hiroki %A Kuroda, Tadahiro %B ISSCC %D 2011 %I IEEE %K dblp %P 230-232 %T 6W/25mm2 inductive power transfer for non-contact wafer-level testing. %U http://dblp.uni-trier.de/db/conf/isscc/isscc2011.html#RadeckiCYMSIK11 %@ 978-1-61284-303-2

@inproceedings{conf/isscc/RadeckiCYMSIK11, added-at = {2011-09-30T00:00:00.000+0200}, author = {Radecki, Andrzej and Chung, Hayun and Yoshida, Yoichi and Miura, Noriyuki and Shidei, Tsunaaki and Ishikuro, Hiroki and Kuroda, Tadahiro}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/21fa2b9792ed46c3595c85ec6099d88bd/dblp}, booktitle = {ISSCC}, crossref = {conf/isscc/2011}, ee = {http://dx.doi.org/10.1109/ISSCC.2011.5746297}, interhash = {dd0877524f8fd51de98e05a6a567aa2f}, intrahash = {1fa2b9792ed46c3595c85ec6099d88bd}, isbn = {978-1-61284-303-2}, keywords = {dblp}, pages = {230-232}, publisher = {IEEE}, timestamp = {2016-02-02T12:12:54.000+0100}, title = {6W/25mm2 inductive power transfer for non-contact wafer-level testing.}, url = {http://dblp.uni-trier.de/db/conf/isscc/isscc2011.html#RadeckiCYMSIK11}, year = 2011 }