PUMA

academical publication management
collect, organize, and share publications

( en | de )

 

Disambiguation of "Chang, Yao-Wen"

Author of the publication

copydeleteadd this publication to your clipboard
Placement of defect-tolerant digital microfluidic biochips using the T-tree formulation.

, , and . JETC, 3 (3): 13 (2007)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

Yao Wang University of Stuttgart

Dr. -Ing. Christoph Wenzel University of Stuttgart

Dr. rer. nat. Tim Wendlandt University of Stuttgart

Ingeborg Wenger University of Stuttgart

Florian Wenz University of Stuttgart

 

Other publications of authors with the same name

Timing-driven routing for symmetrical-array-based FPGAs., , and . ICCD, page 628-633. (1998)Global Interconnect Planning., , and . Handbook of Algorithms for Physical Design Automation, Auerbach Publications, (2008)Multilayer Global Routing With Via and Wire Capacity Considerations., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 29 (5): 685-696 (2010)ECO Optimization Using Metal-Configurable Gate-Array Spare Cells., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 32 (11): 1722-1733 (2013)Escape Routing for Staggered-Pin-Array PCBs., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 32 (9): 1347-1356 (2013)Pulsed-Latch Aware Placement for Timing-Integrity Optimization., , , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 30 (12): 1856-1869 (2011)Multilevel Full-Chip Gridless Routing With Applications to Optical-Proximity Correction., and . IEEE Trans. on CAD of Integrated Circuits and Systems, 26 (6): 1041-1053 (2007)Voltage-Drop Aware Analytical Placement by Global Power Spreading for Mixed-Size Circuit Designs., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 30 (11): 1649-1662 (2011)Analog Placement Based on Symmetry-Island Formulation., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 28 (6): 791-804 (2009)TSV-Aware Analytical Placement for 3-D IC Designs Based on a Novel Weighted-Average Wirelength Model., , and . IEEE Trans. on CAD of Integrated Circuits and Systems, 32 (4): 497-509 (2013)