Author of the publication

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

No persons found for author name Detalle, Mikael
add a person with the name Detalle, Mikael
 

Other publications of authors with the same name

Si interposer build-up options and impact on 3D system cost., , , and . 3DIC, page 1-5. IEEE, (2013)Active-lite interposer for 2.5 & 3D integration., , , , , , , , , and 5 other author(s). VLSIC, page 222-. IEEE, (2015)A calibrated pathfinding model for signal integrity analysis on interposer., , , , , and . CICC, page 1-4. IEEE, (2012)Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges., , , , , , , and . 3DIC, page 1-7. IEEE, (2014)Analysis of 3D interconnect performance: Effect of the Si substrate resistivity., , , and . 3DIC, page 1-4. IEEE, (2014)Analysis of microbump induced stress effects in 3D stacked IC technologies., , , , , , , , , and 9 other author(s). 3DIC, page 1-5. IEEE, (2011)Processing active devices on Si interposer and impact on cost., , , , , , , , , and . 3DIC, page TS11.2.1-TS11.2.4. IEEE, (2015)3D stacking using ultra thin dies., , , , , , and . 3DIC, page 1-5. IEEE, (2011)