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Disambiguierung von "Kuczynska, Marta"

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The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics.

, , , , , , und . Microelectronics Reliability, (2017)

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Marta Burczyk University of Stuttgart

Marta Gil Pérez University of Stuttgart

 

Weitere Publikationen von Autoren mit dem selben Namen

Numerical Prediction of Failure in SnAgCu solder under shear and tensile-dominant cyclic loading, , , , und . 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Piscataway, NJ, IEEE, (2019)Nonlocal Damage Modeling of Solder Joint Failure under Thermal and Thermomechanical cyclic Loading, , , , , und . Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021), Seite V001T06A003. New York, NY, USA, the American Society of Mechanical Engineers, (2021)The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics., , , , , , und . Microelectronics Reliability, (2017)Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load, , , , , , und . Microelectronics Reliability, 91 (1): 67-85 (2018)Numerical Modeling of Continuous Dynamic Recrystallization in Sn-Based Solder Connection Under Cyclic Loading, , , und . Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2021), Seite V001T06A004. New York, NY, USA, the American Society of Mechanical Engineers, (2021)Effect of shear and tensile-dominant cyclic loading on failure in SnAgCu solder, , , und . Microelectronics reliability, 120 (May): 114101 (2021)