Author of the publication

The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics.

, , , , , , and . Microelectronics Reliability, (2017)

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name