%0 Journal Article %1 journals/mr/KuczynskaSBMKBW17 %A Kuczynska, Marta %A Schafet, Natalja %A Becker, Ulrich %A Métais, B. %A Kabakchiev, Alexander %A Buhl, P. %A Weihe, Stefan %D 2017 %J Microelectronics Reliability %K dblp %P 155-164 %T The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics. %U http://dblp.uni-trier.de/db/journals/mr/mr74.html#KuczynskaSBMKBW17 %V 74

@article{journals/mr/KuczynskaSBMKBW17, added-at = {2019-05-29T00:00:00.000+0200}, author = {Kuczynska, Marta and Schafet, Natalja and Becker, Ulrich and Métais, B. and Kabakchiev, Alexander and Buhl, P. and Weihe, Stefan}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/24120dbee9ff159b45d60416c679d818a/dblp}, ee = {https://doi.org/10.1016/j.microrel.2017.04.013}, interhash = {21a2f0259ecb63c532c5a5531ec00674}, intrahash = {4120dbee9ff159b45d60416c679d818a}, journal = {Microelectronics Reliability}, keywords = {dblp}, pages = {155-164}, timestamp = {2019-09-27T10:58:34.000+0200}, title = {The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr74.html#KuczynskaSBMKBW17}, volume = 74, year = 2017 }