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Mechanical Stability of Ultra-Thin Chips Down to 6 Μm, , , , , and . (2010)Bestimmung der mechanischen Stabilität ultradünner Chips, , , , , and . Proceedings : Mikrosystemtechnik-Kongress 2011 : 10. - 12. Oktober 2011, Darmstadt, page 737-740. Berlin, VDE-Verlag, (2011)Stress Analysis of Ultra-Thin Silicon Chip-On-Foil Electronic Assembly under Bending, , , , , , , and . (August 2014)Mechanical Characterisation Of Ultra-Thin Chips, , , , , and . 2011 Semiconductor Conference Dresden, Piscataway, New Jersey, IEEE, (2011)Ultra-Thin Silicon Chips On Flexible Substrates, , , and . (2009)Sudden Event Monitoring of Civil Infrastructure Using Demand-Based Wireless Smart Sensors., , , , , and . Sensors, 18 (12): 4480 (2018)Scalable and transparent approach to media archive using digital object architecture., and . SpringSim (ANSS), page 6. SCS/ACM, (2013)Imbedding Ultra-Thin Chips in Polymers, , , , , and . page 1-6. (2011)Ultra-thin chip fabrication for next-generation silicon processes, , , , and . 2009 IEEE Bipolar/BiCMOS Circuits and Technology Meeting, page 131-137. Piscataway, New Jersey, IEEE, (2009)Ultra-thin chip technology for system-in-foil applications, , , , , , , , and . 2010 International Electron Devices Meeting, page 2.5.1.-2.5.4.. Piscataway, New Jersey, IEEE, (2010)