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Disambiguation of "Rempp, Horst"

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Mechanical Characterisation Of Ultra-Thin Chips

, , , , , and . 2011 Semiconductor Conference Dresden, Piscataway, New Jersey, IEEE, (2011)
DOI: 10.1109/SCD.2011.6068727

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Hon. -Prof. Dr. Horst Hardenberg University of Stuttgart

Horst Speichert University of Stuttgart

Dr. -Ing. Horst Silcher University of Stuttgart

Prof. Dr. Horst Kramer University of Stuttgart

Horst Friedrich University of Stuttgart

 

Other publications of authors with the same name

Compensation of externally applied mechanical stress by stacking of ultra-thin chips, , , and . 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC), page 279-282. Piscataway, New Jersey, IEEE, (2011)Packaging Challenges Associated With Warpage Of Ultra-Thin Chips, , , , and . 3rd Electronics System Integration Technology Conference ESTC, Piscataway, New Jersey, IEEE, (2010)Compensation pf Externally Applied Mechanical Stress by Stacking Of Ultrathin Chips, , , and . Solid-State Electronics, (August 2012)Ultra-Thin Chips on Foil for Flexible Electronics., , , , , , , , and . ISSCC, page 334-335. IEEE, (2008)Thermal characterization and modeling of ultra-thin silicon chips., , , , , and . ESSDERC, page 397-400. IEEE, (2014)Ultra-thin chips and related applications, a new paradigm in silicon technology, , , , , and . 2009 Proceedings of the European Solid State Device Research Conference, page 29-36. Piscataway, New Jersey, IEEE, (2009)Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips, , , , and . IEEE Electron Device Letters, 33 (3): 444-446 (March 2012)Bestimmung der mechanischen Stabilität ultradünner Chips, , , , , and . Proceedings : Mikrosystemtechnik-Kongress 2011 : 10. - 12. Oktober 2011, Darmstadt, page 737-740. Berlin, VDE-Verlag, (2011)Manufacturing aspects of an ultra-thin chip technology, , , , , , , , , and . 2012 Proceedings of the European Solid-State Device Research Conference (ESSDERC), page 141-144. Piscataway, New Jersey, IEEE, (2012)Mechanical Characterisation Of Ultra-Thin Chips, , , , , and . 2011 Semiconductor Conference Dresden, Piscataway, New Jersey, IEEE, (2011)