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Disambiguation of "Lee, Sae Kyu"

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A Wide Dynamic Range Sparse FC-DNN Processor with Multi-Cycle Banked SRAM Read and Adaptive Clocking in 16nm FinFET.

, , , , , and . ESSCIRC, page 158-161. IEEE, (2018)

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Moosung Lee University of Stuttgart

Dongwon Lee University of Stuttgart

Junghwa Lee University of Stuttgart

Ph. D. Benjamin Lee University of Stuttgart

Muhammad Shahrukh Saeed University of Stuttgart

 

Other publications of authors with the same name

TuneLogic: Post-silicon tuning of dual-Vdd designs., , and . ISQED, page 394-400. IEEE Computer Society, (2009)A multi-chip system optimized for insect-scale flapping-wing robots., , , , , , , , and . VLSIC, page 152-. IEEE, (2015)A 16-Core Voltage-Stacked System With Adaptive Clocking and an Integrated Switched-Capacitor DC-DC Converter., , , , and . IEEE Trans. VLSI Syst., 25 (4): 1271-1284 (2017)A 16nm 25mm2 SoC with a 54.5x Flexibility-Efficiency Range from Dual-Core Arm Cortex-A53 to eFPGA and Cache-Coherent Accelerators., , , , , , , , , and . VLSI Circuits, page 34-. IEEE, (2019)A 7-nm Four-Core Mixed-Precision AI Chip With 26.2-TFLOPS Hybrid-FP8 Training, 104.9-TOPS INT4 Inference, and Workload-Aware Throttling., , , , , , , , , and 34 other author(s). IEEE J. Solid State Circuits, 57 (1): 182-197 (2022)DNN Engine: A 28-nm Timing-Error Tolerant Sparse Deep Neural Network Processor for IoT Applications., , , and . J. Solid-State Circuits, 53 (9): 2722-2731 (2018)A Wide Dynamic Range Sparse FC-DNN Processor with Multi-Cycle Banked SRAM Read and Adaptive Clocking in 16nm FinFET., , , , , and . ESSCIRC, page 158-161. IEEE, (2018)Evaluation of voltage stacking for near-threshold multicore computing., , and . ISLPED, page 373-378. ACM, (2012)A Fully Integrated Battery-Powered System-on-Chip in 40-nm CMOS for Closed-Loop Control of Insect-Scale Pico-Aerial Vehicle., , , , , , , , , and . J. Solid-State Circuits, 52 (9): 2374-2387 (2017)SMIV: A 16-nm 25-mm² SoC for IoT With Arm Cortex-A53, eFPGA, and Coherent Accelerators., , , , , and . IEEE J. Solid State Circuits, 57 (2): 639-650 (2022)