T. Groezinger, P. Wild, und H. Kueck. Molded interconnect devices : 11th international congress ; September 24th - 25th, 2014, Nuremberg/Fuerth, Germany, (2014)
J. Mei, R. Haug, O. Lanier, T. Grözinger, und A. Zimmermann. Microelectronics Reliability, (2018)29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis ( ESREF 2018 ).
J. Mei, R. Haug, O. Lanier, T. Grözinger, und A. Zimmermann. Microelectronics Reliability, (2018)29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis ( ESREF 2018 ).