When electronic assemblies are experiencing high current loading conditions, thermo-mechanical mismatch induced from the local Joule heating of the component and electromigration (EM)-induced void formation can lead to the failure of the solder interconnect. Scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) are adopted to investigate the microstructural evolution of solder joints of shunt components subjected to current stressing. Voids and micro-cracks initiate at the corner of solder meniscus, where the maximal divergence of material flux density is located on the basis of finite element method (FEM) simulation. The EM-induced voids introduce higher accumulated plastic strain in the solder joints, which will result in reduction in the lifetime of the electronic assemblies.
%0 Journal Article
%1 MEI2019113350
%A Mei, J.
%A Haug, R.
%A Hinderberger, S.
%A Grözinger, T.
%A Zimmermann, A.
%D 2019
%J Microelectronics Reliability
%K groezinger haug hinderberger ifm_article mei zimmermann
%P 113350
%R https://doi.org/10.1016/j.microrel.2019.06.042
%T Void formation in solder joints under power cycling conditions and its effect on reliability
%U https://www.sciencedirect.com/science/article/pii/S0026271419304317
%V 100-101
%X When electronic assemblies are experiencing high current loading conditions, thermo-mechanical mismatch induced from the local Joule heating of the component and electromigration (EM)-induced void formation can lead to the failure of the solder interconnect. Scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) are adopted to investigate the microstructural evolution of solder joints of shunt components subjected to current stressing. Voids and micro-cracks initiate at the corner of solder meniscus, where the maximal divergence of material flux density is located on the basis of finite element method (FEM) simulation. The EM-induced voids introduce higher accumulated plastic strain in the solder joints, which will result in reduction in the lifetime of the electronic assemblies.
@article{MEI2019113350,
abstract = {When electronic assemblies are experiencing high current loading conditions, thermo-mechanical mismatch induced from the local Joule heating of the component and electromigration (EM)-induced void formation can lead to the failure of the solder interconnect. Scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) are adopted to investigate the microstructural evolution of solder joints of shunt components subjected to current stressing. Voids and micro-cracks initiate at the corner of solder meniscus, where the maximal divergence of material flux density is located on the basis of finite element method (FEM) simulation. The EM-induced voids introduce higher accumulated plastic strain in the solder joints, which will result in reduction in the lifetime of the electronic assemblies.},
added-at = {2023-06-16T15:40:27.000+0200},
author = {Mei, J. and Haug, R. and Hinderberger, S. and Grözinger, T. and Zimmermann, A.},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2fb7854059b64c9ea58941885134e08b2/samethalvaci},
doi = {https://doi.org/10.1016/j.microrel.2019.06.042},
interhash = {cb61292320150582b921c042552753e5},
intrahash = {fb7854059b64c9ea58941885134e08b2},
issn = {0026-2714},
journal = {Microelectronics Reliability},
keywords = {groezinger haug hinderberger ifm_article mei zimmermann},
note = {30th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis},
pages = 113350,
timestamp = {2023-06-16T15:40:27.000+0200},
title = {Void formation in solder joints under power cycling conditions and its effect on reliability},
url = {https://www.sciencedirect.com/science/article/pii/S0026271419304317},
volume = {100-101},
year = 2019
}
