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Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

, , , , , , and . Journal of Manufacturing and Materials Processing, (2020)
DOI: 10.3390/jmmp4010026

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Rapid Prototyping von Molded Interconnect Devices (MID), , , , , , and . (2018)A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation, , , , and . IEEE Access, (April 2019)Bestückung additiv gefertigter Mechatronic Interconnect Devices (MID) mittels Laserlöten, , , , , , and . MikroSystemTechnik Kongress 2017, page 360-362. VDE Verlag GmbH, (October 2017)Duroplastische Verkapselungsgehäuse für die Integration von elektrischen Ankontaktierungen und Steckern, , , , , and . Beiträge zum 27. Stuttgarter Kunststoffkolloquium, 27, page 115-122. Institut für Kunststofftechnik, Universität Stuttgart, (2021)Simulationsgestützte Zuverlässigkeitsanalysen von MID - Baugruppen unter Temperaturbelastung, , and . (December 2011)An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages, , , , , , and . Journal of Manufacturing and Materials Processing, (2019)Investigations on Flexural Fatigue Strength of Conductor Paths Fabricated by LPKF-LDS® Technology, , , , and . Journal of Micro and Nano-Manufacturing, (December 2017)011004.Experimental and computational study of array effects on LED thermal management on molded interconnect devices MID, , , , , and . 2018 13th International Congress Molded Interconnect Devices (MID), page 315. Molded Interconnect Devices 3-D MID e. V., (September 2018)Investigations on Flexural Fatique Strenght of Conductor Paths Fabricated by LPKF-LDS® Technology, , , , , and . Proceedings of 4M/IWMF2016, 4M Association, Research Publishing, (September 2016)Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding, , , , , , and . Journal of Manufacturing and Materials Processing, (2020)