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Duroplastische Verkapselungsgehäuse für die Integration von elektrischen Ankontaktierungen und Steckern

, , , , , and . Beiträge zum 27. Stuttgarter Kunststoffkolloquium, 27, page 115-122. Institut für Kunststofftechnik, Universität Stuttgart, (2021)

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Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging, , , , , , , and . IMAPS 2020 Symposium on Microelectronics : A Global Virtual Conference, 2020, 01, page 140-145. Pittsburgh, International Microelectronics And Packaging Society, (2020)Duroplastische Verkapselungsgehäuse für die Integration von elektrischen Ankontaktierungen und Steckern, , , , , and . Beiträge zum 27. Stuttgarter Kunststoffkolloquium, 27, page 115-122. Institut für Kunststofftechnik, Universität Stuttgart, (2021)Surface Optimization of Micro-Integrated Reflective Optical Elements by Thermoset Injection Molding, , , , , , , and . Applied Sciences, 10 (12): 4197 (2020)Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding Compounds, , , , , , , and . Applied mechanics, 2 (4): 976-995 (2021)An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages, , , , , , and . Journal of Manufacturing and Materials Processing, (February 2019)Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging, , , , , , , and . International Symposium on Microelectronics, 2020 (1): 000140-000145 (January 2021)3D Conductive Tracks on Thermoset Packages for Advanced System Integration, , , , , , and . Proceedings of the 14th International Congress Molded Interconnect Devices, page 570-594. Molded Interconnect Devices 3-D MID e. V., (February 2021)Duroplastische Verkapselungsgehäuse für die Integration von elektrischen Ankontaktierungen und Steckern, , , , , and . 27. Stuttgarter Kunststoffkolloquium, page 115-122. Stuttgart, Institut für Kunststofftechnik, Universität Stuttgart, (2021)An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages, , , , , , and . Journal of Manufacturing and Materials Processing, (2019)Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding Compounds, , , , , , , and . Applied Mechanics, 2 (4): 976-996 (2021)