Author of the publication

A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation

, , , , and . IEEE Access, (April 2019)
DOI: 10.1109/ACCESS.2019.2913786

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices, , , , , and . Instruments, (2018)Zuverlässigkeitsuntersuchungen und Lebensdauermodelle von LEDs auf räumlichen Schaltungsträgern. (2019)Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices, , , , , and . Instruments, 2 (4): 28 (2018)Untersuchungen zu Zuverlässigkeit und Entwärmung von LEDs auf räumlichen Schaltungsträgern. Universität Stuttgart, München, Dissertation, (2019)Surface Optimization of Micro-Integrated Reflective Optical Elements by Thermoset Injection Molding, , , , , , , and . Applied Sciences, 10 (12): 4197 (2020)A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation, , , , and . IEEE Access, (2019)Feasibility of manufacturing packaged electronic systems by thermoset injection molding, , , , , and . 11th Smart Systems Integration Conference 2017 : International Conference and Exhibition on Integration Issues of Miniaturized Systems, page 345-354. Red Hook, Curran Associates, Inc., (2017)Heat dissipation for MID applications in lighting technology, , , , , and . 2016 12th International Congress Molded Interconnect Devices (MID), IEEE, (2016)A Three-dimensional thermal model for a commercial lithium-ion capacitor battery pack with non-uniform temperature distribution., , , , , and . ICIT, page 1126-1131. IEEE, (2019)A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation, , , , and . IEEE Access, (April 2019)