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Characterization of Wire-Bonding on LDS Materials and HF-PCBs for High-Frequency Applications

, , , , and . Journal of Manufacturing and Materials Processing, 6 (1): 9 (2022)
DOI: 10.3390/jmmp6010009

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Improving orchestral conducting systems in public spaces: examining the temporal characteristics and conceptual models of conducting gestures., , and . CHI, page 731-740. ACM, (2005)Impedance-Controlled Design and Connection Technology for Micromounting and Hybrid Integration of High-Frequency and Mixed-Signal Systems with MID Technology, , , , , , , , , and . (April 2018)iSymphony: an adaptive interactive orchestral conducting system for digital audio and video streams., , , , , , and . CHI Extended Abstracts, page 259-262. ACM, (2006)Low-Loss 3D-Coplanar Line Structure for Millimeter Wave Applications Using Laser Direct Structuring Technology, , , , , and . 2021 International Conference on Electromagnetics in Advanced Applications (ICEAA), page 085-085. IEEE, (2021)Investigation on the Influence of Injection Molding Parameters on High Frequency Permittivity up to 3 GHz on MID Thermoplastics and Reliability of Permittivity During Environmental Testing, , , , , , , , , and 2 other author(s). 13th International Congress Molded Interconnect Devices, page 329. Molded Interconnect Devices 3-D MID e. V., (September 2018)Wie gut ist mein Unternehmen im Usability Engineering und wie kann es (noch) besser werden?, , , , , and . Usability Professionals, page 144-147. German UPA e.V., (2012)Education, entertainment and authenticity: lessons learned from designing an interactive exhibit about medieval music., , and . CHI Extended Abstracts, page 1887-1892. ACM, (2007)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Fabrication of 3D Ceramic Interconnect Devices by Laser Induced Selective Metalization, , , , , , , and . (2018)Investigation of LDS-capable PEEK/PEI Blends for Customizable Multilayer LDS-MID for Fabrication ofo Millimeter Wave-Capable High Frequency Module, , , , , , and . (June 2023)