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Towards a Flexible and Adaptive Wireless Hub by Embedding Power Amplifier Thinned Silicon Chip and Antenna in a Polymer Foil

, , , , , , and . International Journal of Microwave and Wireless Technologies, (2019)
DOI: 10.1017/S1759078719000539

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Size reduction and tuning of integrated folded patch antennas using slots, , , and . 34th European Microwave Conference, 2004, page 1337-1340. Piscataway, New Jersey, IEEE, (2004)3-Path 5-6-GHz 0.25-um SiGe BiCMOS Power Amplifier on Thin Substrate, , , , , and . Conference on Ph.D. Research in Microelectronics and Electronics (PRIME), page pp. 49--52. Giardini Naxos, Taormina, Italy, IEEE, (2017)Bridging the gap between optical fibers and silicon photonic integrated circuits, , , , , , and . Optics express, 22 (2): 1277--1286 (2014)Miniaturisierter optischer Drehwinkelsensor mit integrierter Interpolation, , , , , , and . MikroSystemTechnik Kongress 2021, page 716-718. VDE/VDI-Gesellschaft Mikroelektronik, Mikrosystem- und Feinwerktechnik, VDE Verlag GmbH, (November 2021)Adaptive Layout Technique for Microhybrid Integration of Chip-Film Patch, , , , and . IEEE Transactions on Components Packaging and Manufacturing Technology, 8 (5): 802-810 (2018)Poster: Compliant Substrate based on Sintered Porous Silicon for the Local Integration of Heterodevices with Silicon Microelectronics, , , and . (2009)Design of an RF Transmitter for RFID Tags in a New Technology with Ultra Thin Silicon Substrates, , , , , and . Proceedings of the Annual Workshop on Circuits, Systems and Signal Processing (ProRISC), page 193--196. Veldhoven, the Netherlands, (2009)Miniaturized optical encoder with micro structured encoder disk, , , , , , and . Proceedings of the World Congress on Micro and Nano Manufacturing (WCMNM 2018), page 363-366. (2018)Embedding and Interconnecting of Ultra-Thin RF Chip in Combination with Flexible Wireless Hub in Polymer Foil, , , , , , and . Electronic System-Integration Technology Conference (ESTC), page 1--5. Dresden, Germany, IEEE, (2018)3-Path SiGe BiCMOS power amplifier on thinned substrate for IoT applications, , , , , and . Integration, the VLSI Journal, (2018)