Author of the publication

Embedding and Interconnecting of Ultra-Thin RF Chip in Combination with Flexible Wireless Hub in Polymer Foil

, , , , , , and . 2018 7th Electronic System-Integration Technology Conference (ESTC), IEEE, (2018)
DOI: 10.1109/ESTC.2018.8546462

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

Toward a flexible and adaptive wireless hub by embedding power amplifier thinned silicon chip and antenna in a polymer foil, , , , , , and . International Journal of Microwave and Wireless Technologies, 11 (9): 864-871 (2019)Program FFlexCom : High Frequency Flexible Bendable Electronics For Wireless Communication Systems, , , , , , , , , and 44 other author(s). 2017 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS) : 13-15 Nov. 2017, Piscataway, New Jersey, IEEE, (2017)Towards a Flexible and Adaptive Wireless Hub by Embedding Power Amplifier Thinned Silicon Chip and Antenna in a Polymer Foil, , , , , , and . International Journal of Microwave and Wireless Technologies, (2019)Program FFlexCom --- High frequency flexible bendable electronics for wireless communication systems, , , , , , , , , and 44 other author(s). IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS), page 1--6. Tel-Aviv, Israel, IEEE, (2017)Embedding and Interconnecting of Ultra-Thin RF Chip in Combination with Flexible Wireless Hub in Polymer Foil, , , , , , and . 2018 7th Electronic System-Integration Technology Conference (ESTC), IEEE, (2018)