Author of the publication

Towards a Flexible and Adaptive Wireless Hub by Embedding Power Amplifier Thinned Silicon Chip and Antenna in a Polymer Foil

, , , , , , and . International Journal of Microwave and Wireless Technologies, (2019)
DOI: 10.1017/S1759078719000539

Please choose a person to relate this publication to

To differ between persons with the same name, the academic degree and the title of an important publication will be displayed. You can also use the button next to the name to display some publications already assigned to the person.

 

Other publications of authors with the same name

3-Path 5–6 GHz 0.25 μm SiGe BiCMOS power amplifier on thin substrate, , , , , and . 2017 13th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME), page 49-52. Piscataway, New Jersey, IEEE, (2017)Towards a Flexible and Adaptive Wireless Hub by Embedding Power Amplifier Thinned Silicon Chip and Antenna in a Polymer Foil, , , , , , and . International Journal of Microwave and Wireless Technologies, (2019)A Digital Library For A Flexible Low-Voltage Organic Thin-Film Transistor Technology, , , , , , , , and . Organic Electronics, (November 2017)Application Of BCB-On-Si Based Substrate in Combining Flexible Organic Electronics And High Frequency Antenna, , , , , , , , and . (2016)Toward a flexible and adaptive wireless hub by embedding power amplifier thinned silicon chip and antenna in a polymer foil, , , , , , and . International Journal of Microwave and Wireless Technologies, 11 (9): 864-871 (2019)3-Path SiGe BiCMOS power amplifier on thinned substrate for IoT applications, , , , , and . PRIME and SMACD 2017, 63, page 291-298. Amsterdam, Elsevier, (2018)Program FFlexCom : High Frequency Flexible Bendable Electronics For Wireless Communication Systems, , , , , , , , , and 44 other author(s). 2017 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS) : 13-15 Nov. 2017, Piscataway, New Jersey, IEEE, (2017)Hybride Systeme in Folie (HySiF) Mittels Adaptivem Layout Und Laserdirektschreiber, , , , , , and . MikroSystemTechnik Kongress 2017 : MEMS, Mikroelektronik, Systeme 23.-25. Oktober 2017 in München, (2017)1593.Three-Path SiGe BiCMOS LNA on Thinned Silicon Substrate for IoT Applications, , , , and . European Microwave Integrated Circuits Conference (EuMiC), page 273--276. Madrid, Spain, (2018)Hybrid system-in-foil integration and interconnection technology based on adaptive layout technique. Universität Stuttgart, Stuttgart, Dissertation, (2019)