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Disambiguation of "Eberhardt, Wolfgang"

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Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices

, , , , , , and . 2020 43rd International Spring Seminar on Electronics Technology (ISSE), page 1-6. IEEE, (2020)
DOI: 10.1109/ISSE49702.2020.9121136

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Lisa Eberhardt University of Stuttgart

Dr. Wolfgang Frey University of Stuttgart

Replication data of Buchmeiser group for: "Synthetic and Structural Peculiarities of Neutral and Cationic Molybdenum Imido and Tungsten Oxo Alkylidene Complexes Bearing Weakly Coordinating N-Heterocyclic Carbenes", , , , , , and . Dataset, (2024)Related to: M. R. Buchmeiser, D. Wang, R. Schowner, L. Stöhr, F. Ziegler, S. Sen, W. Frey,; Synthetic and Structural Peculiarities of Neutral and Cationic Molybdenum Imido and Tungsten Oxo Alkylidene Complexes Bearing Weakly Coordinating N-Heterocyclic Carbenes; Eur. J. Inorg. Chem., in press (2024). doi: 10.1002/ejic.202400082.

Univ. -Prof. Dr. -Ing. Wolfgang Rheinheimer University of Stuttgart

Univ. -Prof. Dr. Wolfgang Kühnel University of Stuttgart

apl. Prof. Dr. Wolfgang Hauber University of Stuttgart

 

Other publications of authors with the same name

Bestückung additiv gefertigter Mechatronic Interconnect Devices (MID) mittels Laserlöten, , , , , , and . MikroSystemTechnik Kongress 2017, page 360-362. VDE Verlag GmbH, (October 2017)Inkjet and Aerosol Jet Printed Sensors on 2D and 3D Substrates, , , , and . Proceedings AMA Conferences 2015 with SENSOR 2015 17th International Conference on Sensors and Measurement Technology and IRS2015 14th International Conference on Infrared Sensors & Systems, 566-569, AMA Service GmbH, (May 2015)Heat dissipation for MID applications in lighting technology, , , , , and . 2016 12th International Congress Molded Interconnect Devices (MID), page 112-115. (September 2016)Fabrication of 3D Ceramic Interconnect Devices by Laser Induced Selective Metalization, , , , , , , and . (2018)Investigation of Process Parameters on Permittivity for High-Frequency and Mixed-Signal Systems based on LDS Technology, , , , , , , , , and 1 other author(s). (September 2018)Umspritzen von Si-Nacktchips mit Thermoplast und deren Kontaktierung mit der LPKF-LDS® Technik, , , , , , and . Beiträge zum 22. Stuttgarter Kunststoff-Kolloquium, (2011)UV-sintering of inkjet-printed conductive silver tracks, , , , , , and . 2011 11th IEEE International Conference on Nanotechnology, page 201-204. (August 2011)Fabrication of Modules for an Interactive Braille Display with Integrated Touch Sensor by Laser MID Technology, , , , , , , and . Proceedings of the 6th International Conference on Multi-Material Micro Manufacture, (September 2009)Erweiterung des Einsatzbereiches von laserstrukturierten 3D-MID durch die Verwendung von keramischen Substratmaterialien, , , , , , , , and . MikroSystemTechnik Congress 2021, (2021)Investigation of LDS-capable PEEK/PEI Blends for Customizable Multilayer LDS-MID for Fabrication ofo Millimeter Wave-Capable High Frequency Module, , , , , , and . (June 2023)