%0 Conference Paper %1 haussler2020solderability %A Häußler, Felix %A Petillon, Simon %A Dornheim, Johannes %A Weser, Sascha %A Eberhardt, Wolfgang %A Zimmermann, André %A Franke, Jörg %B 2020 43rd International Spring Seminar on Electronics Technology (ISSE) %D 2020 %I IEEE %K %P 1-6 %R 10.1109/ISSE49702.2020.9121136 %T Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices %@ 978-1-7281-6773-2 and 978-1-7281-6772-5 and 978-1-7281-6774-9

@inproceedings{haussler2020solderability, added-at = {2023-08-31T14:56:58.000+0200}, author = {Häußler, Felix and Petillon, Simon and Dornheim, Johannes and Weser, Sascha and Eberhardt, Wolfgang and Zimmermann, André and Franke, Jörg}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2802857c977b65a1761d26115bd117da4/puma-wartung}, booktitle = {2020 43rd International Spring Seminar on Electronics Technology (ISSE)}, doi = {10.1109/ISSE49702.2020.9121136}, eventdate = {2020-05-14/2020-05-15}, eventtitle = {2020 43rd International Spring Seminar on Electronics Technology (ISSE)}, interhash = {9960bcae221d980f589262b290425f0d}, intrahash = {802857c977b65a1761d26115bd117da4}, isbn = {{978-1-7281-6773-2} and {978-1-7281-6772-5} and {978-1-7281-6774-9}}, keywords = {}, language = {eng}, pages = {1-6}, publisher = {IEEE}, timestamp = {2023-08-31T12:56:58.000+0200}, title = {Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices}, venue = {Demanovska Valley, Slovakia}, year = 2020 }